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| D1 D3 ARF1510 G3 D1 D3 G1 S1D2 G3 G1 S1D2 S3D4 G2 ARF1510 S3D4 RF POWER MOSFET FULL-BRIDGE * Specified 300 Volt, 27.12 MHz Characteristics: * Output Power = 750 Watts. * Gain = 17dB (Class D) * Efficiency > 80% MAXIMUM RATINGS Symbol VDSS ID VGS PD TJ,TSTG TL Parameter Drain-Source Voltage Continuous Drain Current @ TC = 25C Gate-Source Voltage Total Device Dissipation @ TC = 25C Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. G4 G2 S2 G4 S4 S2 S4 400V 750W 40MHz The ARF1510 is four RF power transistor arranged in an H-Bridge configuration. It is intended for off-line 300V operation in high power scientific, medical and, industrial RF power generator and amplifier applications up to 40 MHz. * High Performance Power RF Package. * Very High Breakdown for Improved Ruggedness. * Low Thermal Resistance. * Nitride Passivated Die for Improved Reliability. All Ratings Per Die: TC = 25C unless otherwise specified. ARF 1510 UNIT Volts Amps Volts Watts C 1000 6.5 30 1500 -55 to 200 300 STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS VDS(ON) IDSS IGSS g fs V isolation VGS(TH) Characteristic / Test Conditions Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 A) On State Drain Voltage 1 MIN TYP MAX UNIT Volts A nA mhos Volts 1000 6.8 7.5 25 250 100 3 2500 3 5 4 (ID(ON) = 3.25A, VGS = 10V) Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V) Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125C) Gate-Source Leakage Current (VGS = 30V, VDS = 0V) Forward Transconductance (VDS = 25V, ID = 3.25A) RMS Voltage (60Hz Sinewave from terminals to mounting surface for 1 minute) Gate Threshold Voltage (VDS = VGS, ID = 50mA) Volts THERMAL CHARACTERISTICS Symbol RJC RCS Characteristic (per package unless otherwise noted) Junction to Case Case to Sink (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 1-2005 050-4926 Rev B 0.12 0.08 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com DYNAMIC CHARACTERISTICS Symbol Ciss Coss Crss td(on) tr td(off) tf Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Test Conditions VGS = 0V VDS = 200V f = 1 MHz VGS = 15V VDD = 500V ID = 6.5A @ 25C RG = 1.6 MIN TYP MAX ARF1510 UNIT 1200 100 20 8 5 18 10 1800 130 26 pF ns FUNCTIONAL CHARACTERISTICS Symbol GPS Characteristic Common Source Amplifier Power Gain Drain Efficiency Electrical Ruggedness VSWR 6:1 Test Conditions f = 40.7 MHz VGS = 0V VDD = 400V MIN TYP MAX UNIT dB % 13 15 75 Pout = 750W No Degradation in Output Power 1 Pulse Test: Pulse width < 380 S, Duty Cycle < 2%. APT Reserves the right to change, without notice, the specifications and information contained herein. D1 D3 .100 .175 D1 D3 HAZARDOUS MATERIAL WARNING G3 G1 G3 1.065" 27.05 mm S1D2 ARF1510 S3D4 .100 .075 .100 .175 G1 S1D2 S3D4 G2 G2 S2 G4 S4 .100 .075 .100 G4 .300 1.065" 27.05 mm .300 S2 S4 The ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. .254 .045 .005 Thermal Considerations and Package Mounting: The rated 1500W power dissipation is only available when the package mounting surface is at 25C and the junction temperature is 200C. The thermal resistance between junctions and case mounting surface is 0.12C/W. When installed, and additional thermal impedance of 0.08C/W between the package base and the mounting surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heat sink should incorporate a copper heat spreader to obtain best results. The package is designed to be clamped to a heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. A simple clamp and two 6-32 (M3.5) screw can provide the minimum 125lb required mounting force. T = 12 in-lb. 050-4926 Rev B 1-2005 Clamp ARF 1510 Heat Sink |
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